$365.00 (USA and Canada only)
SNAP-ODC-32-SRC SNAP-ODC-32-SRC-FM
SNAP-ODC-32-SNK SNAP-ODC-32-SNK-FM
Switching Voltage
5–60 VDC
Nominal Switching Voltage
12–24 VDC
Logic Voltage and Current
5 VDC ± 0.1 @ 150 mA
Maximum Off State Voltage
60 VDC
Output Leakage, Typical
<10 microamps per channel (60 V, 70 °C)
Maximum Load per Point
0.25 A
Voltage Drop
0.15 VDC @ 0.25 A
Surge (1 sec.)
1 A
Output Arrangement
32 output channels; 4 groups of 8 outputs each. Points in each group share a common positive connection.
32 output channels; 4 groups of 8 outputs each. Points in each group share a common negative connection.
Maximum Operating Common Mode Voltage
250 V
Isolation: Field to Logic
1500 V
Output Turn-On/Off Time
100 microseconds
Polling time from I/O processor to module1
2–30 ms typical2
Indicators
None; use optional OptoTerminal-G20 diagnostic display or breakout rack.
None; use optional OptoTerminal-G20 diagnostic display or breakout rack.
Maximum Number of HDD Modules on One Mounting Rack
16
Torque, hold-down screws
4 in-lb (0.45 N-m)
Torque, connector screws
5.26 in-lb (0.6 N-m)
Operating Temperature
-20 to 70 °C
Storage Temperature
-40 to 85 °C
Agency Approvals
SNAP-ODC-32-SRC: UL, CE, RoHS, DFARS
SNAP-ODC-32-SRC-FM: CE, FM, RoHS, DFARS
SNAP-ODC-32-SNK: UL, CE, RoHS, DFARS
SNAP-ODC-32-SNK-FM: CE, FM, RoHS, DFARS
Warranty
Lifetime
1 Affects turn-on and turn-off determination 2 Time varies based on the SNAP PAC I/O processor (brain or on-the-rack controller), processor configuration, and Ethernet host communication activity.
This document shows which SNAP I/O modules, breakout boards, and cables can be used together.
This document compares 4-channel and high-density SNAP digital I/O modules.
This document lists and describes all Opto 22 SNAP PAC System part numbers, including PAC Project software, SNAP PAC controllers, SNAP PAC brains, and SNAP I/O modules of all kinds. SNAP PAC mounting racks and SNAP power supplies are also listed.
SNAP I/O high-density digital modules from Opto 22 provide 16 or 32 digital input or output points in one compact SNAP module. These modules are ideal for OEMs and others who have high point-count applications, or for anyone requiring more than 64 digital points on a single SNAP PAC rack. The high-density configuration reduces per-point costs of digital I/O systems by providing up to eight times as many I/O points in the same space. SNAP high-density digital modules are part of the SNAP PAC System. They can also be used as part of intelligent remote I/O with an Allen-Bradley Logix PLC system. HDD modules require a SNAP PAC R-series controller or a SNAP PAC brain for I/O processing. These modules work with standard wired controllers and brains and with Wired+Wireless models.
This guide covers how to install and test SNAP 16-channel and 32-channel digital modules, part of the SNAP PAC System. These modules provide 16 or 32 points of digital input or digital output in the same space as a 4-channel digital module. They are ideal for OEMs and for anyone who needs up to 512 digital points on a single mounting rack.
This document is the Manufacturer's Declaration of Conformity for the products listed herein, in accordance with European, international, and/or national standards and regulations.
Are you confused about sinking and sourcing when wiring DC circuits? This technical note explains what sinking and sourcing mean, explores where you would use one wiring method rather than the other, and shows how to use a digital output module with your DC circuit.
Press release for SNAP-UDC-HDB-G4 and SNAP-UDC-HDB breakout racks for SNAP 32-point SNAP digital I/O modules.
This document describes migration options for customers integrating the SNAP PAC System with older Opto 22 systems. It explains the SNAP PAC System's similarities and differences with earlier systems, defines legacy products, and shows how to mix old and new hardware. Customers moving to the SNAP PAC System may also want to consult form #1693, Legacy and Current Product Comparison and Compatibility Charts.
This document is a statement of compliance with the EU Directive 2015/863/EU, Restriction of Hazardous Substances (RoHS 3). This document lists Opto 22 products that comply with the substance restrictions of the RoHS 3 directive.
This technical note is for customers using SNAP high-density digital modules with ioControl 6.1 and ioDisplay 6.0.
This document lists all Opto 22 part numbers that have Factory Mutual (FM) approval.
This CAD file contains a 3-dimensional drawing of the SNAP-ODC-32 32-channel digital input and output modules. The drawing applies to the following modules:
This overview describes the four integrated components of the SNAP PAC system: software, controllers, brains and I/O. This hardware and software system is designed for industrial control, remote monitoring and data acquisition.
A quick overview on securing a SNAP Module to a SNAP rack.
A quick overview on removing a SNAP module.
Learn more about Sinking vs. Sourcing.
What's the difference between accuracy and resolution in analog I/O specifications? Try your own specs in the calculator.
Switching a DC circuit? Learn about sinking and sourcing, and the digital output modules to use with each.
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